Design Entry Revision History. Design Entry for SoC Devices. Firewall Planning 5. Boot And Configuration Considerations 5.
Reset Configuration 5. Boot And Configuration Considerations. Configuration Sources 5. HPS Clock Planning 5. Internal Clocks 5. Reset Configuration. System Reset Considerations. Design Guidelines for Flash Interfaces 5. I2C Interface Design Guidelines.
Consider Device Driver Availability 5. MDIO 5. Signal Integrity. Design Guidelines for Flash Interfaces. Recommended System Topologies 5. Information on How to Configure and Use the Bridges. Interface Bandwidths. Recommended System Topologies. System Level Cache Coherency 5.
Clocking and Reset Design Considerations 5. Clock and PLL Selection 5. PLL Feature Guidelines 5. Clock Control Features 5. Dual-Purpose and Special Pin Connections 5. PLL Feature Guidelines. Clock Feedback Mode 5. Clock Outputs. EMIF Considerations. Memory Interfaces 5. HPS Memory Debug. Board and Software Considerations. Early System and Board Planning 6.
Pin Connection Considerations for Board Design 6. Board Considerations Revision History. Early System and Board Planning. SmartVID 6. Thermal Management and Design 6. Temperature Sensing for Thermal Management 6. Voltage Sensor 6. Device Power-Up 6. Power Pin Connections and Power Supplies 6. Planning for Device Configuration. Power Pin Connections and Power Supplies.
Decoupling Capacitors 6. Transceiver Board Design Guidelines. Device Power Cycling and Reconfiguration 6. Configuration Scheme Selection 6. Configuration Features 6. Configuration Pin Connections. Configuration Scheme Selection. Serial Configuration Devices 6. Download Cables. Optional Configuration Pins 6. Dual Purpose Configuration Pins. Configuration Pin Voltage Level 6. Clock Trace Signal Integrity 6. JTAG Pins 6. Other Configuration Pins. Boundary Scan for HPS 6.
Embedded Software Debugging and Trace. Pin Connection Considerations for Board Design. Signal Integrity Considerations 6. Unused Pins. Signal Integrity Considerations. High-Speed Board Design 6. Voltage Reference Pins 6. Simultaneous Switching Noise 6. Design Implementation, Analysis, Optimization, and Verification. Selecting a Synthesis Tool 7. Device Resource Utilization Reports 7. Timing Constraints and Analysis 7. Area and Timing Optimization 7.
Preserving Performance and Reducing Compilation Time 7. Simulation 7. Power Analysis 7. Power Optimization 7. Timing Constraints and Analysis. Recommended Timing Optimization and Analysis Assignments. Power Optimization. Device and Design Power Optimization Techniques 7. Device and Design Power Optimization Techniques. All Application Notes. Please contact sales office if device weight is not available. All rights reserved.
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Status: In Production. The device reduces external components by integrating the USB termination resistors. Four of the pins have alternate functions to indicate USB and communication status. Read More. Product Features. Recommended for Automotive Design.
Operating voltage: 3. Parametrics Click on a property to perform a parametric search for other products with that property. Embedded Software. Development Environment. Dynamic Product Page. Learn More. The module is comprised of a single DIP form-factor board.
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